Title:
EXPANDING METHOD, SEMICONDUCTOR DEVICE PRODUCTION METHOD, AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2019/172217
Kind Code:
A1
Abstract:
The expanding method of the invention is characterized by comprising: an adhesion step of adhering a plurality of adherends onto a first adhesive material layer (12) or a second adhesive material layer (13) of an adhesive sheet (10) having the first adhesive material layer (12) containing a first energy beam curable resin, the second adhesive material layer (13) containing a second energy beam curable resin, and a base material (11); an expanding step of stretching the adhesive sheet (10) to expand the intervals between the plurality of adherends; and an energy beam irradiation step of irradiating an energy beam onto the first adhesive material layer (12) and the second adhesive material layer (13) causing the first adhesive material layer (12) and the second adhesive material layer (13) to be cured.
Inventors:
INAO YOUICHI (JP)
OKAMOTO NAOYA (JP)
YAMADA TADATOMO (JP)
OKAMOTO NAOYA (JP)
YAMADA TADATOMO (JP)
Application Number:
PCT/JP2019/008510
Publication Date:
September 12, 2019
Filing Date:
March 05, 2019
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; H01L21/683
Foreign References:
| JP2016127116A | 2016-07-11 | |||
| JP2007146104A | 2007-06-14 | |||
| JP2003064329A | 2003-03-05 | |||
| JP2002083785A | 2002-03-22 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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