Title:
EXPANSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/106051
Kind Code:
A1
Abstract:
The purpose of the present disclosure is to provide an expansion device capable of manufacturing with good yield without an increase in the degree of difficulty during manufacturing. The expansion device according to the present disclosure comprises: a first substrate having a first main surface and a second main surface facing each other; a first wiring and a second wiring provided on the first main surface and extending along the first main surface; an expandable second substrate having a third main surface and a fourth main surface facing each other; and an expandable third wiring and fourth wiring provided on the fourth main surface and extending along the fourth main surface, the first substrate and the second substrate being connected, and the shortest distance between the first wiring and the second wiring being less than the shortest distance between the third wiring and the fourth wiring.
Inventors:
NISHIDA KEISUKE (JP)
NAKAMURA YUI (JP)
HORI NOBUYASU (JP)
NAKAMURA YUI (JP)
HORI NOBUYASU (JP)
Application Number:
PCT/JP2022/042423
Publication Date:
June 15, 2023
Filing Date:
November 15, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H05K1/14
Domestic Patent References:
| WO2019138855A1 | 2019-07-18 | |||
| WO2020137078A1 | 2020-07-02 |
Foreign References:
| JP2011034822A | 2011-02-17 | |||
| JP2016178121A | 2016-10-06 | |||
| JPS56172980U | 1981-12-21 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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