Title:
EXPANSION METHOD AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/158767
Kind Code:
A1
Abstract:
An expansion method comprising: adhering a first adhesive sheet (10) having a first adhesive layer (12) and a first substrate (11) to a first wafer surface (W1) of a wafer (W) having a first wafer surface (W1) and a second wafer surface (W3), and adhering a second adhesive sheet having a second adhesive layer and a second substrate to the second wafer surface (W3); making a cut from the first adhesive sheet (10) side to cut the first adhesive sheet (10) and dice the wafer (W) into a plurality of chips (CP); adhering a third adhesive sheet (30) having a third adhesive layer (32) and a third substrate (31) to the first substrate (11); separating the second adhesive sheet from the second wafer surface (W3) of the wafer (W); and stretching the third adhesive sheet (30) to widen the interval between the plurality of chips (CP).
Inventors:
FUSE KEISHI (JP)
INAO YOUICHI (JP)
YAMADA TADATOMO (JP)
INAO YOUICHI (JP)
YAMADA TADATOMO (JP)
Application Number:
PCT/JP2020/003072
Publication Date:
August 06, 2020
Filing Date:
January 29, 2020
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J201/00; C09J7/38; H01L21/301
Domestic Patent References:
| WO2018003602A1 | 2018-01-04 |
Foreign References:
| JP2014029921A | 2014-02-13 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
Download PDF:
Previous Patent: EXPANSION METHOD AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
Next Patent: EXPANSION METHOD AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
Next Patent: EXPANSION METHOD AND SEMICONDUCTOR DEVICE PRODUCTION METHOD