Title:
EXPOSURE APPARATUS AND METHOD, AND DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/179295
Kind Code:
A1
Abstract:
This exposure apparatus is for exposing a wafer, held by a shuttle, to an electron beam, and is provided with: a movable stage to which the shuttle holding the wafer is detachably attached; an electrostatic attracting device that electrostatically attracts the wafer to the shuttle; and a gas supply device that supplies a gas to a space between the shuttle and the wafer during at least a portion of a period when the wafer is attracted by the electrostatic attracting device. The present invention can suppress damage to a substrate and generation of out-of-place objects from the substrate caused by the attraction when the substrate is attracted and held while the substrate is conveyed or exposed.
Inventors:
SATO SHINJI (JP)
FUNATSU TAKAYUKI (JP)
ICHINOSE GO (JP)
FUNATSU TAKAYUKI (JP)
ICHINOSE GO (JP)
Application Number:
PCT/JP2017/013477
Publication Date:
October 04, 2018
Filing Date:
March 30, 2017
Export Citation:
Assignee:
NIKON CORP (JP)
International Classes:
G03F7/20; H01L21/67
Domestic Patent References:
| WO2016167339A1 | 2016-10-20 | |||
| WO2010095540A1 | 2010-08-26 |
Foreign References:
| JP2016207756A | 2016-12-08 | |||
| JP2011099156A | 2011-05-19 | |||
| JP2014216503A | 2014-11-17 |
Attorney, Agent or Firm:
OMORI Satoshi (JP)
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