EXPOSURE MASK, METHOD FOR MANUFACTURING THE MASK, AND EXPOSURE METHOD

Title:

EXPOSURE MASK, METHOD FOR MANUFACTURING THE MASK, AND EXPOSURE METHOD

Document Type and Number:

WIPO Patent Application WO/2002/052622

Kind Code:

A1

Abstract:

In order to sensitize all the resist in the area irradiated with an electron beam in the direction of the film thickness, it is necessary to increase the acceleration voltage of the electron beam. However, the energy of the accelerated electron is increased as the acceleration voltage is increased. If the electron of such high energy collides with a stencil mask of an exposure mask, the stencil mask is heated and is expanded, and the stencil mask is deformed thereby. An exposure mask not deformed because of heat is realized by solving the problems. The exposure mask comprises a patterning mask having apertures, and at least one mask for heat absorption which is disposed on the patterning mask separately from the patterning mask, and the apertures in the patterning mask are aligned with the apertures in the mask for heat absorption.

Inventors:

SASAGO MASARU (JP)
ENDO MASAYUKI (JP)
HISATSUGU TOKUSHIGE (JP)

Application Number:

PCT/JP2001/011475

Publication Date:

July 04, 2002

Filing Date:

December 26, 2001

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC IND CO LTD (JP)
PD SERVICE CORP (JP)
SASAGO MASARU (JP)
ENDO MASAYUKI (JP)
HISATSUGU TOKUSHIGE (JP)

International Classes:

G03C5/00; G03F1/20; G03F1/22; G03F1/68; G03F7/20; G03F9/00; H01L21/027; (IPC1-7): H01L21/027

Foreign References:

JP2000188254A	2000-07-04
JPH065499A	1994-01-14
JPH05326381A	1993-12-10

Other References: