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Patent Searching and Data


Title:
EXTERNAL PACKAGING MATERIAL FOR VACUUM HEAT INSULATION MATERIAL, VACUUM HEAT INSULATION MATERIAL, AND ARTICLE WITH VACUUM HEAT INSULATION MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/187871
Kind Code:
A1
Abstract:
The present disclosure provides an external packaging material for a vacuum heat insulation material, the external packaging material having: a gas barrier film having a metallic aluminum film; and an adhesive layer disposed directly on the metallic aluminum film, wherein the adhesive layer contains an adhesive component, and a silicon-containing compound in which at least one among a hydrolyzable group and a hydroxyl group is directly bonded to a silicon atom, and the adhesive layer has an atomic ratio of the silicon atom of 1.5-7.0 at%.

Inventors:
MUNEDA, Taku (1-1, Ichigaya-kagacho 1-chome, Shinjuku-k, Tokyo 01, 〒1628001, JP)
IMAI, Masahiro (1-1, Ichigaya-kagacho 1-chome, Shinjuku-k, Tokyo 01, 〒1628001, JP)
MIZOSHIRI, Makoto (1-1, Ichigaya-kagacho 1-chome, Shinjuku-k, Tokyo 01, 〒1628001, JP)
Application Number:
JP2019/007001
Publication Date:
October 03, 2019
Filing Date:
February 25, 2019
Export Citation:
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Assignee:
DAI NIPPON PRINTING CO., LTD. (1-1 Ichigaya-kagacho 1-chome, Shinjuku-ku Tokyo, 01, 〒1628001, JP)
International Classes:
F16L59/065; B32B7/027; B32B15/20
Domestic Patent References:
WO2016159140A12016-10-06
Foreign References:
JP2011226644A2011-11-10
JP2001323210A2001-11-22
JP2005144719A2005-06-09
JP2007153957A2007-06-21
Attorney, Agent or Firm:
YAMASHITA, Akihiko et al. (3rd Floor Oak Building Kyobashi, 16-10, Kyobashi 1-chome, Chuou-k, Tokyo 31, 〒1040031, JP)
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