Title:
FABRICATION OF MULTI-DIMENSIONAL MICROSTRUCTURES
Document Type and Number:
WIPO Patent Application WO/2011/005921
Kind Code:
A3
Abstract:
A method for forming a multi-dimensional microstructure, such as but not limited to a three dimensional (3-D) microstructure coil for use in a data transducer of a data storage device. In accordance with some embodiments, the method generally includes providing a base region comprising a first conductive pathway embedded in a first dielectric material; etching a plurality of via regions in the first dielectric material that are each partially filled with a first seed layer that contacts the embedded first conductive pathway; and using the first seed layer to form a conductive pillar in each of the plurality of via regions, wherein each conductive pillar comprises a substantially vertical sidewall that extends to a first distance above the base region.
Inventors:
STADNIYCHUK HELENA (US)
HABERMAS ANDREW (US)
HABERMAS ANDREW (US)
Application Number:
PCT/US2010/041295
Publication Date:
March 03, 2011
Filing Date:
July 08, 2010
Export Citation:
Assignee:
SEAGATE TECHNOLOGY LLC (US)
STADNIYCHUK HELENA (US)
HABERMAS ANDREW (US)
STADNIYCHUK HELENA (US)
HABERMAS ANDREW (US)
International Classes:
G11B5/17; H01F17/00; H01L21/02
Domestic Patent References:
| WO2002073702A1 | 2002-09-19 |
Foreign References:
| US6187647B1 | 2001-02-13 | |||
| US20030005569A1 | 2003-01-09 | |||
| US20030109118A1 | 2003-06-12 | |||
| JP2001144444A | 2001-05-25 | |||
| US6008102A | 1999-12-28 |
Attorney, Agent or Firm:
BUENZOW, Jennifer (7801 Computer Avenue SouthBloomington, MN, US)
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