Title:
FAN-OUT-LIKE MULTI-DEVICE HYBRID INTEGRATED FLEXIBLE MICROSYSTEM AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/233072
Kind Code:
A1
Abstract:
A fan-out-like multi-device hybrid integrated flexible microsystem and a preparation method therefor, belonging to the field of microelectronics. The flexible microsystem uses micro-electromechanical system (MEMS) chips and/or integrated circuit (IC) chips as device units, and uses flexible isolation grooves (9) filled with polymers as flexible connections between the device units, and the electrical interconnection between the device units is realized by means of a metal wiring layer (4). The multi-device hybrid integrated flexible microsystem produced by means of the fan-out-like method in the present invention retains the excellent electrical performance of silicon-based devices, and also realizes the overall flexibility of the microsystem, and has a stable structure and reliable performance.
Inventors:
WANG WEI (CN)
DONG XIAO (CN)
DONG XIAO (CN)
Application Number:
PCT/CN2018/120227
Publication Date:
December 12, 2019
Filing Date:
December 11, 2018
Export Citation:
Assignee:
UNIV BEIJING (CN)
International Classes:
B81B7/00
Foreign References:
| CN106025050A | 2016-10-12 | |||
| CN202003990U | 2011-10-05 | |||
| CN206955629U | 2018-02-02 | |||
| CN106684003A | 2017-05-17 | |||
| CN103681458A | 2014-03-26 | |||
| CN102543924A | 2012-07-04 | |||
| US20020182778A1 | 2002-12-05 |
Attorney, Agent or Firm:
BEIJING JOYSHINE INTELLECTUAL PROPERTY OFFICE (CN)
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