Title:
FAST-CURING LEAD-FREE SOLDER PASTE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/036951
Kind Code:
A1
Abstract:
A fast-curing lead-free solder paste and a preparation method therefor. The fast-curing lead-free solder paste comprises, in parts by weight: 80-90 parts of a tin alloy powder, 3-5 parts of rosin, 10-20 parts of an organic solvent and 1-10 parts of a resin. Compared with an existing solder paste, the fast-curing lead-free solder paste has a significantly decreased curing temperature and an obviously shortened curing time, and the problem of substrate warpage due to a high curing temperature can be avoided. The lead-free solder paste does not contain lead, such that the solder paste is environmentally friendly and does not damage the atmosphere, and the heavy metal pollution of the environment is also greatly reduced.
Inventors:
HUANG LISI (CN)
XUE GUANGBIN (CN)
ZHENG FUDONG (CN)
XUE GUANGBIN (CN)
ZHENG FUDONG (CN)
Application Number:
PCT/CN2020/135752
Publication Date:
February 24, 2022
Filing Date:
December 11, 2020
Export Citation:
Assignee:
HUIZHOU YUAN DE ZHI TECH CO LTD (CN)
International Classes:
B23K35/26
Foreign References:
| CN111940946A | 2020-11-17 | |||
| CN102770232A | 2012-11-07 | |||
| CN101585118A | 2009-11-25 | |||
| CN101011784A | 2007-08-08 | |||
| CN110303274A | 2019-10-08 | |||
| CN103358046A | 2013-10-23 | |||
| JP2009241126A | 2009-10-22 |
Attorney, Agent or Firm:
COHORIZON INTELLECTUAL PROPERTY INC. (CN)
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