Title:
FEATURE FAILURE CORRELATION
Document Type and Number:
WIPO Patent Application WO2006039625
Kind Code:
A3
Abstract:
Techniques are disclosed for determining the likelihood that a known feature in an integrated circuit design will cause a defect during the manufacturing process. According to some of these techniques, various logical units that incorporate an identified design feature are identified, and the amount that the design feature occurs in each of a plurality of these logical units is determined. The failure rate of integrated circuit portions corresponding to at least these logical units are then obtained. A feature failure coefficient indicating the likelihood that the feature will cause a defect then is determined by correlating the failure rates with the amount of occurrences of the feature. Some of these techniques additionally are used to identify new design features that are more likely to cause a defect. More particularly, the failure rates for logical units are predicted based upon the amount of the known features occurring in each of the logical units and their predicted impact upon the yield of portions of an integrated circuit corresponding to these logical units. These predicted failure rates are then compared with the actual failure rates of integrated circuit portions corresponding to the logical units, and the portions having the largest discrepancy are identified.
Inventors:
ABERCROMBIE DAVID (US)
JAHANGIRI JAY (US)
JAHANGIRI JAY (US)
Application Number:
PCT/US2005/035422
Publication Date:
August 17, 2006
Filing Date:
October 03, 2005
Export Citation:
Assignee:
MENTOR GRAPHICS CORP (US)
ABERCROMBIE DAVID (US)
JAHANGIRI JAY (US)
ABERCROMBIE DAVID (US)
JAHANGIRI JAY (US)
International Classes:
G06F17/50
Foreign References:
| US5777901A | 1998-07-07 | |||
| US20040138852A1 | 2004-07-15 | |||
| US20030028352A1 | 2003-02-06 |
Other References:
CIPLICKAS D J ET AL: "Predictive yield modeling of VLSIC's", STATISTICAL METROLOGY, 2000 5TH INTERNATIONAL WORKSHOP ON 11 JUNE 2000, PISCATAWAY, NJ, USA,IEEE, 2000, pages 28 - 37, XP010511914, ISBN: 0-7803-5896-1
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