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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2019/093192
Kind Code:
Provided is a fiber-containing resin structure S which is a resin composition comprising a thermosetting resin 1 and fibers 2 fixed therein, the thermosetting resin 1 comprising a resole-type phenolic resin, the fibers 2 having an average length in the range of 1-50 mm, and the thermosetting resin having a content of the resole-type phenolic resin of 50 mass% or higher. In said resin composition, it is preferable that the fibers 2 should have been dispersed in an opened state in the thermosetting resin 1. Due to this, the fiber-containing resin structure S gives cured objects having further improved heat resistance.

INOKUCHI, Hideaki (5-8, Higashi-shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
Application Number:
Publication Date:
May 16, 2019
Filing Date:
October 30, 2018
Export Citation:
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SUMITOMO BAKELITE CO., LTD. (5-8 Higashi-shinagawa 2-chome, Shinagawa-ku Tokyo, 02, 〒1400002, JP)
International Classes:
C08L61/10; B29B9/14; C08J5/04; C08K7/02
Attorney, Agent or Firm:
ASAHI, Kazuo et al. (Nishi-Shinbashi Noa Bldg. 4th Floor, 18-9 Nishi-Shinbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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