TITLE

FIBER OPTIC MEMS SEISMIC SENSOR WITH MASS SUPPORTED BY

HINGED BEAMS

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application claims priority from U.S. Provisional Patent Application No.

60/794,948, filed on April 26, 2006, and titled FIBER OPTIC MEMS SEISMIC SENSOR WITH MASS SUPPORTED BY HINGED BEAMS, which is hereby incorporated in its entirety by reference.

FIELD OF THE INVENTION

[0002] The present invention generally relates to mechanical optical devices, and, more particularly, to micro-electro-mechanical optical devices having a mass supported by hinged beams.

BACKGROUND

[0003] The traditional method for detecting land seismic signals has been the coil- type geophone. Geophone sensors consist of a mass-spring assembly contained in a cartridge about 3cm long and weighing about 75grams. In a typical geophone sensor, the spring is soft and as the cartridge case moves the mass (coil) is held in place by its

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own inertia. Thus, the coil acts as a reference for measurement of the cartridge displacement. This sensor arrangement is ideal for measurement of large, oscillatory displacements on the order of millimeters with sub-micrometer resolution. However, the frequency range of these sensors is limited. For best sensitivity to small displacements, a given sensor has a mechanical bandwidth of about 10Hz. Sensors can be designed with center frequencies from 20Hz to 100Hz.

[0004] Micro-Electro-Mechanical Systems (MEMS) are miniature mechanical components fabricated in silicon wafers. The fabrication methods are based on the same photolithographic and etching processes used to manufacture electronic circuits in silicon. In fact, most MEMS devices include not only miniature mechanical components such as nozzles, gears, etc. but also integrated electronic components to provide local signal conditioning. Unfortunately, the integrated circuits limit the maximum operating temperature of electronic MEMS to 75°C. The maximum temperature limit can be extended to 400 ⁰ C or more if optical fiber sensors are integrated with mechanical MEMS components so that no electronics are needed in the high temperature environment.

[0005] Recently, MEMS acceleronieters have been developed for 3-component (3C)

_. land seismic measurements. In the MEMS accelerometer, a mass-spring assembly is also used, but, unlike the geophone, the spring is stiff and the mass moves with the case that houses the MEMS. The inertia of the mass causes strain and deflection of the spring and the deflection or strain that can be measured with a sensor to determine the acceleration

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of an object. Capacitance sensors may also be incorporated into high performance 3C MEMS accelerometers to determine the acceleration of an object.

[0006] The measurement range of accelerometers is specified in units of 'G' where

IG = 9.8m/s ² . Commercial specifications include 12OdBV dynamic range (IG to 10 ^"6 G) and 500Hz mechanical bandwidth with 24-bit digital resolution equivalent to a noise limited performance of 10 ^"7 G/(Hz) ^lβ . The accelerometer is fabricated on a silicon chip on the order of 100mm ² . Three single-axis accelerometers (each with an application specific integrated circuit (ASIC) for signal conditioning) are packaged to measure in three orthogonal directions. The limitation of these accelerometers is an upper limit on the operating temperature of 75°C, which is imposed by the electronic integrated circuits and is not a fundamental limitation of silicon itself.

SUMMARY OF INVENTION

[0007] The present invention relates to a proof mass supported by a frame having supporting beams. The proof mass is positioned within the frame and has a hinged attachment to the beams. The proof mass has a sensor gap having a first reflector and a second reflector positioned at opposing ends of the sensor gap. An optical fiber injects light into the sensor gap and light is reflected to determine seismic movement of the proof mass with respect to the frame. Stops are provided for limiting the movement of the proof mass to minimize strain on the attachment of the beams and the proof mass.

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DESCRIPTION OF THE DRAWINGS

[0008] Operation of the invention may be better understood by reference to the following detailed description taken in connection with the following illustrations, wherein:

10009] FIGURE 1 is a perspective view of a proof mass supported by hinged support beams in an embodiment of the present invention;

[0010] FIGURE 2A is a side perspective view of an assembled MEMS die in an embodiment of the present invention;

[0011] FIGURE 2B is a cross-sectional view taken generally along line A-A of the assembled MEMS die of FIGURE 2A;

[0012] FIGURE 3 is a cross-sectional view of a sensor assembly in an embodiment of the present invention;

[0013] FIGURE 4 is a diagrammatical view of a fiber optic sensor with a proof mass supported by hinged beams in an embodiment of the present invention;

[0014] FIGURE 5 is a cross-sectional view of a silicon-on-insulator wafer in an embodiment of the present invention; [0015] FIGURE 6 is a cross-sectional view of a silicon wafer etched to define a thickness of a proof mass in an embodiment of the present invention;

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[0016] FIGURE 7 is a cross-sectional view of a silicon wafer etched to define a hole in an embodiment of the present invention;

[0017] FIGURE 8 is a cross-sectional view of a silicon wafer having a reflector deposited on glass at the bottom of a hole in an embodiment of the present invention;

[0018] FIGURE 9 is a graphical representation of the reflectance versus wavelength of a gold coating reflector on glass in an embodiment of the present invention;

[0019] FIGURE 10 is a graphical representation of the transmittance versus wavelength for a gold coating on glass in an embodiment of the present invention;

[0020] FIGURE 11 is a cross-sectional view of a silicon wafer having a glass surface bonded to a frame in an embodiment of the present invention;

[0021] FIGURE 12 is a cross-sectional view of a silicon wafer having a third layer etched to expose a perimeter of a proof mass in an embodiment of the present invention;

[0022] FIGURE 13 is a cross-sectional view of a silicon wafer etched to release beams supporting a proof mass in an embodiment of the present invention;

[0023] FIGURE 14 is a cross-sectional view of a silicon wafer having a glass surface with stops bonded to a the wafer in an embodiment of the present invention;

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[0024] FIGURE 15 is a graphical representation of an interference signal versus gap for two light beams reflected by a reflector Rl and a reflector R2 in an embodiment of the present invention;

[0025] FIGURE 16 is a perspective view of the first embodiment of the triaxial assembly, where three sensors are mounted on the three mutually perpendicular surfaces at the apex of a corner of a cube in an embodiment of the present invention;

[0026] FIGURE 17 is a perspective view of an alternative embodiment of the triaxial assembly, where two sensors are shown, the third sensor would exit the page and be perpendicular to the two sensors shown; and

[0027] FIGURE 18 is a graphical representation of a finite element stress analysis of a silicon proof mass supported by hinged support beams in an embodiment of the present invention.

DETAILED DESCRIPTION

[0028] While the present invention is described with reference to the embodiments described herein, it should be clear that the present invention should not be limited to such embodiments. Therefore, the description of the embodiments herein is illustrative of the present invention and should not limit the scope of the invention as claimed.

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[0029] The present invention relates to a micro-electro mechanical system (MEMS) sensor. More specifically, the present invention relates to an interferometric MEMS optical sensor that may be used for seismic sensing. In an embodiment of the invention, the components of the optical seismic sensor are positioned to form an interferometric gap.

[0030] Figures 1 and 3 illustrate a frame 12 supporting beams 16a-16d and a proof mass 14 that may be incorporated into a sensor assembly 10. The beams 16a-16d support the proof mass 14 that may be positioned within the frame 12. In an embodiment, the proof mass 14 and the beams 16a-16d are made of silicon. One of ordinary skill in the art will appreciate that other materials may be used and that the present invention is not deemed as limited to any specific type of material. The beams 16a-16d are secured to the frame 12 to provide a stable and robust arrangement of the sensor assembly 10.

[0031] At an end of the beams 16a-16d opposite the frame 12, the beams 16a-16d are secured to the proof mass 14, as illustrated in Figure 1. In a preferred embodiment, the beams 16a-16d are secured to the proof mass 14 with hinges and/or secondary- beams. To this end, the hinged attachment of the beams 16a-16d to the proof mass 14 allows the proof mass 14 to move freely with respect to the beams 16a-16d. The beams 16a-16d are secured to the proof mass 14 at corners of the proof mass 14. In addition, the beams 16a-16d may have a uniform thickness between the frame 12 and the proof mass 14.

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[00321 A hole 18 is etched or otherwise formed in the proof mass 14. The hole 18 is a flat-bottom hole in the proof mass 14. The beams 16a- 16 supporting the proof mass 14 are attached such that the proof mass 14 and, thus, the hole 18 moves with respect to the frame 12. In an embodiment, the proof mass 14 moves in the y-direction as shown in Figure 1.

[0033] Figure 2A illustrates a side perspective view of a MEMS die 20 in an embodiment of the present invention. In the embodiment of the invention illustrated in Figure 2, the frame 12 is made of silicon and positioned between glass wafers 22. In a preferred embodiment, the glass wafers 22 are borosilicate glass and are bonded to the top and the bottom surface of the frame 12. The glass wafers 22 as referred herein should not be deemed as limited to glass or borosilicate glass and may be any other materials as will be appreciated by one of ordinary skill in the art.

[0034] A cross-sectional view taken generally along line A-A of the MEMS die 20 is illustrated in Figure 2B. An optical fiber assembly 24 can be inserted into hole 24 in glass wafer 22 to direct light to the hole 18 of the proof mass 14 as shown in Figure 3. In this embodiment, the beams 16a and 16b having a uniform thickness are shown in Figure 2B. The glass wafers 22 are illustrated on opposing sides of the frame 12.

[0035] The proof mass 14 moves freely in the ± y direction with respect to the frame

12. The configuration and performance of the sensor assembly 10 in an embodiment where the sensor assembly 10 is silicon are provided in Table 1.

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Table 1 Performance and Dimensional Summary

* E is Young's modulus for silicon.

[0036] Figure 3 illustrates an assembled view of the sensor 10 in an embodiment of the present invention. The optical fiber assembly 31 has an optical fiber 30 held within the optical fiber assembly 31. The optical fiber 30 extends toward the hole 18 to transmit light to and/or receive reflected light from the hole 18 in the proof mass 14. A first tube 32 houses the optical fiber assembly 31. The optical fiber assembly is contained within a second tube 33. The optical fiber 30 is contained within tube 35 and both optical fiber and tube 35 are held within tube 33 and extend through the outer tube 32 and toward the hole 18. The end of tube 33 fits within the hole in first glass wafer 22. In an embodiment, two tubes 34 are positioned within the tube 33 at each end tube 35 to center tube 35 within tube 33. The tubes 32-35, may be made of metal, glass and/or a suitable material for housing the optical fiber assembly 31.

[0037] A material 36 is positioned adjacent to an end of the first tube 32. The material 36 may also be positioned between tube 33 and tube 35 in the region between tubes 34. In a preferred embodiment, the member 36 is rubber, for example, silicone rubber. A plate 38 is positioned at an opposite end of the first tube 32 and opposite from the member 36. The plate 38 is positioned between the first glass wafer 22 and the first tube 32. The optical fiber assembly 31 may extend through the plate 38 toward the hole 18. In an embodiment, the plate 38 is metal and is welded to tube 32.

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A solder 41 is provided for bonding or otherwise securing the first glass wafer 22 and the plate 38. The solder 41 may be made of various materials as known to one of ordinary skill in the art.

[0038] An optical fiber 30 injects light into the sensor assembly 10. For example, the optical fiber 30 may inject light in the C band (at approximately 1550nm) remotely by a signal conditioner/interrogator. Light exits the end of the optical fiber 30 as illustrated in Figure 4. The end of optical fiber 30 and the end of tube 35 are polished at an angle greater that 6° to the normal to reduce back reflection into the optical fiber 30.

[0039] Light is transmitted to the flat-bottom hole 18 and a portion of the light is reflected by reflector Rl, as illustrated in Figure 4. The portion of the light reflected from the reflector Rl is indicated as Beam A. The Rl surface is the inner surface of first glass wafer 22, which may be a glass surface, such as, a borosilicate glass surface. In an embodiment, a coating may be applied onto the reflector Rl surface to increase the reflectance. The amount of reflectance of the reflector Rl may be set to a predetermined level by, for example, selecting a substance and/or a coating for the glass surface that provides the predetermined level of reflectance.

[0040] Light not reflected at the reflector Rl travels to reflector R2 and is reflected as illustrated in Figure 4. The light reflected from the reflector R2 is indicated as Beam B. Beam B is reflected by the surface at the bottom of flat-bottom hole 18. The sensor gap is defined by the separation between the reflector Rl and the reflector R2.

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In a preferred embodiment, the reflectance of the reflector R2 is greater than the reflectance of the reflector Rl. In such an embodiment, the reflector R2 is a coating that increases the reflectance. For example, in an exemplary embodiment, the reflector R2 is a gold coating. The reflector R2 is positioned and/or deposited and thus is bonded to the proof mass 14 at the bottom of flat-bottom hole 18.

[0041] Other materials may be chosen for the reflectors Rl and R2 as shown in

Figure 4. In an embodiment, bare borosilicate glass (having a 3.7 % reflectance) is used for the reflector Rl , but other materials may be used to increase the reflectance. For example, a high index-low index dielectric stack may be used for the reflector Rl to increase the reflectance to 40% or more, if desired. In addition, materials other than the gold coating for the reflector R2 may be used. For example, aluminum, silver and/or a dielectric stack may be used to obtain a high reflectance for the reflector R2. The present invention should not be deemed as limited to any specific material for the reflectors Rl and R2.

[0042] Movement of the proof mass 14 with respect to the frame 12 changes the sensor gap defined as the separation between reflectors Rl and R2. The Beams A and B reflect back into the optical fiber 30 and may, for example, interfere on the surface of a photodiode detector in the signal conditioner (not shown). The interference signal of the Beams A and B is analyzed to precisely determine the sensor gap. The sensor 10 is, therefore, capable of sensing seismic movement.

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[0043] Figures 5-14 illustrate a method of manufacturing and/or fabricating the sensor

10. The method of manufacturing the sensor 10 as set forth in Figures 5-14 is provided as an example, and other methods of fabricating the sensor 10 as known by one of ordinary skill in the art are contemplated. Figures 5-14 illustrate fabricating the sensor 10 using wafer processing technology, such as, for example, masking, etching and bonding methods.

[0044] Figure 5 illustrates a wafer 50, such as a silicon wafer, for masking, etching and/or bonding to fabricate the sensor 10. The wafer 50 has a first layer 52, a second layer 54 and a third layer 56. The second layer 54 is positioned between the first layer 52 and the third layer 56. In a preferred embodiment, the first layer 52 is silicon, such as, silicon epitaxial ("EPI"); the second layer 54 is silicon dioxide; and the third layer 56 is a silicon handle layer that is removable from the first layer 52 and the second layer 54. The particular materials and substances of the wafer 50 and the layers 52, 54, 56 are provided as mere examples of one embodiment of the invention. Other materials and substances may be used to fabricate the sensor 10.

[0045] As illustrated in Figure 6, the first layer 52 may be etched to define a depth 60 of the first layer 52 and/or the proof mass 14. Figure 7 illustrates etching or otherwise defining the depth of the hole 18, a perimeter of the proof mass 14 and/or a thickness of the beams 16a-16d. The reflector R2 is deposited at the bottom of 18 as illustrated in Figure 8. In this embodiment, the reflector R2 is a gold coating, such as chromium-gold coating, and is deposited at the bottom of hole 18. For example, the reflector R2 is deposited on the second silicon dioxide layer 54 at the bottom of hole

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18. Figure 9 illustrates a graph of the percentage of reflectance of the reflector R2 on the second layer 54 at given wavelengths of the light transmitted from the optical fiber 30. More specifically, Figure 9 is shown where the reflector R2 is a chromium-gold coating deposited on layer 54 which is silicon dioxide.

[0046] Figure 10 illustrates a graph of the transmittance of the light from the optical fiber 30 through the reflector R2 where the reflector R2 is a chromium-gold coating. As illustrated, the transmittance is low such that substantially all of the light will be reflected from the reflector R2 in this embodiment. Figure 11 illustrates etching and/or drilling of the first glass wafer 22 and anodic bonding attachment of first glass wafer 22 onto the first layer 52. The first glass wafer 22 is preferably borosilicate glass but other materials for transmitting light to the bottom of hole 18 may be used. The first glass wafer 22 as illustrated in Figure 11 may have a counterbored configuration (tiered orientation), for example, a first larger hole sized to receive tube 33 and a second cut-out sized to receive tube 35 of the optical fiber assembly 31. In a preferred embodiment, the glass wafer 22 is sized and shaped to receive the optical fiber assembly 31.

[0047] Figure 12 illustrates etching or otherwise removing the third (handle) layer 56 and a portion of the second layer 54. As shown, the second layer 54 is etched to remove the second layer 54 from the frame 12 and the beams 16a-16d. Figure 13 illustrates etching or otherwise partially removing the first layer 52 to detach or release the beams 16a-16d from the first layer 52.

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[0048] The second glass wafer 22 is bonded to the perimeter of the first layer 52 at the frame 12 as shown in Figure 14. The second glass wafer 22 has stops 53a, 53b that are etched into the glass wafer 22 to limit the movement of the proof mass 14. The second glass wafer 22 is preferably borosilicate glass and anodically bonded to the frame 12. For example, the stops 53a, 53b will limit the movement of the proof mass 14 to a predetermined distance to prevent excessive stress and possible breakage and failure of the beams 16a-16d.

[0049] . Figure 18 illustrates the stops 53a, 53b limiting the displacement of the proof mass 14. A lateral shock of approximately 150Og is applied in the x-direction and the stops 53a, 53b limit the displacement of the proof mass 14 in the y-direction. In a preferred embodiment, the proof mass 14 is limited to a displacement of approximately five micrometers in the y-direction. The finite element stress analysis of Figure 18 illustrates that the stress on the hinged attachment of the beams 16a-16d to the proof mass 14 is maintained at or below approximately 24 x 10 Pa or about 0.3% of the of the tensile strength of silicon.

[0050] Figure 15 illustrates a graph of the light intensity ratio (or interference signal) versus the sensor gap for the Beams A and B. In this illustration, the reflector Rl has a 3.7% reflectance, the reflector R2 has a reflectance of 98.5% and the light from the optical fiber 30 is in the C band range.

[0051] In use, the sensor 10 may be attached and/or secured in various orientations to accurately determine seismic movement. Figure 16 illustrates a triaxial assembly of

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the sensors 100 attached to the corner of a cube 101. In this embodiment, the sensors 100 are positioned on three mutually perpendicular surfaces at the apex of corners of the cube 101. Figure 17 illustrates another embodiment of the orientation of the sensors 100 where two sensors 100a, 100b are positioned at adjacent edges perpendicular to each other. The third sensor (not shown) is positioned out of the page and mutually perpendicular to the sensors 100a, 100b.

The invention has been described above and, obviously, modifications and alternations will occur to others upon a reading and understanding of this specification. The claims as follows are intended to include all modifications and alterations insofar as they come within the scope of the claims or the equivalent thereof.

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