The CMP process can be separated into two major categories : 1. The material transition process involving the complete removal of a material, such as tungsten or copper, from the surface of the wafer until the underlying material layer is exposed.

2. The film thinning process involving the removal of material, such as SI02 or silicon, until a predetermined thickness remains.

Optical endpointing is one method of monitoring the reflectivity of the wafer surface during planarization and controlling the CMP process based on changes in said reflectivity. Both CMP categories can be successfully monitored with the use of monochromatic light, However, monochromatic light does not allow instantaneous film thickness measurement for the film thinning process. Endpoint systems using monochromatic light can only infer the amount of film removed during the process by monitoring the process over time, compiling several measurements, and subtracting a known beginning thickness. Endpoint systems using broadband light analyze several wavelengths of the reflectance simultaneously, and can thus measure the instantaneous film thickness directly.

In either case, the key to accurately measuring the wafer surface reflectivity is to position an optical sensor in such a way as to receive a noise-free signal. Sources of noise include thermal variations associated with the CMP process, electro-magnetic interference (EMI), light absorption, lens fogging, electrical slip-ring resistance fluctuations, and air bubbles.

In the case where the sensor is an electronic device, EMI, thermal, and slip-ring noise pose problems. Typically, polishing tables are driven by large variable-speed electric motors, which emit strong electro-magnetic fields of various frequencies. Any electrical conductor transitioning these fields will be subject to induced noise.

Opto-electronic devices brought into contact with the CMP process are subject to the thermal fluctuations of the process. Polishing pad friction and exothermic chemical reactions create wide temperature changes. Optical responsivity, Johnson noise, and shot noise all increase as a function of temperature. Therefore, opto-electronic devices typically need to be temperature stabilized before their output is a true measure of the incident radiation. Also, polishing pads are manufactured using heat and pressure. In some cases manufacturing temperatures can exceed the maximum temperature rating specified in the data sheets of the device. Exceeding this rating shortens their life span, or even causes immediate malfunction.

Electrical slip rings used to couple signals from the rotating table are very sensitive to the corrosive CMP chemicals and their vapors. They wear quickly in this environment and begin to suffer from intermittent variations in their contact resistance, which results in random sensor noise. Mercury wetted slip rings are less susceptible this problem, but they are typically limited to operating temperature below 70 degrees Celsius.

Optical sensors installed into the polishing table rely upon a transparent window glued into a hole punched completely through the polishing pad. This arrangement also suffers from optical noise problems, because the pad window tends to leak and thereafter forms a layer of condensate on its under side. Light passing through the condensate layer is scattered, which results in unreliable sensor performance. This particular problem is also temperature related, and can produce indeterminate effects on the optical signal integrity.

CMP processes rely heavily upon liquid chemicals known as slurry, which are not equally translucent to all wavelengths of light. The pad window will carry a layer of slurry along as it transitions under the wafer. As the thickness of this slurry layer increases, more of the light is lost due to absorption and scattering. The thickness of the slurry layer is affected by the position of the pad window with respect to the center of the wafer. For CMP tools whose spindles oscillate and rotate during processing, the slurry layer trapped between the pad window and the wafer will vary as the spindle traverses from side to side. It is theorized that this effect is caused by the difference in relative velocity between the wafer and the polishing pad. At one extreme in the spindle's stroke the wafer is rotating in the same direction as the polishing pad, and at the other extreme the wafer is rotating in the opposite direction. As the relative velocity between wafer surface and pad increases, the slurry layer between pad window and wafer shrinks as the wafer is sucked towards the pad, and the pad window deflects upwards in response to the suction. The result is a periodic disturbance in the optical signal, whose frequency is equivalent to the spindle oscillation frequency, and whose strength is a function of slurry translucence, wafer diameter, table speed, spindle speed, and spindle oscillation stoke.

Air bubbles can produce temporary lens-like occlusions at the pad window and diffract the light in unexpected directions. Even seemingly small bubbles trapped along the fringes of the window can pose a problem when they are sandwiched between the wafer and window lens. The creation of these bubbles increases with table speed and may be due to air being sucked out from the cavity beneath leaking pad windows.

Low-pass filtering is commonly used to attenuate the noise. In most cases, frequency components of the reflectance signals are low compared to those for the noise, Sometimes high order, low cut-off frequency low pass filtering are necessary to adequately attenuate the noise. Material transition processes often exhibit rapid changes in reflectivity at the instant of break through. Using such filtering introduces a significant phase shift in the observed reflectance signal, which causes the endpoint control system to lag behind the process, and results in over-polishing of the wafer.

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above mentioned noise sources associated with monitoring the surface reflectivity of a wafer undergoing CMP. The invention provides an apparatus for delivering light to and receiving a corresponding reflection from the wafer surface by embedding a non-removable optical wave-guide within the polishing pad and providing a means of coupling light into and out of the wave-guide while the pad is rotating. Another object of the invention is to provide a means for determining the angular position of the polishing pad.

DETAILED DESCRIPTION OF THE INVENTION The present invention is an apparatus for delivering light to and receiving surface reflectance from a wafer undergoing CMP. It does so by embedding a fiber-optic wave- guide within the polishing pad. The wave-guide is a combination of lenses and mirrors, which act together to guide light into the polishing pad, through its interior, and out of the pad, at a location within the wafer track. The wave-guide also guides light reflected by the wafer back into the polishing pad, through its interior, and out of the its center of the rotation.

The present invention is also an apparatus for coupling light into one end of the optical wave-guide located at the center of rotation of a polishing pad. It does so by locating a removable vacuum suction hub onto the pad, and supplying vacuum to the suction hub to anchor it firmly and in close proximity to the optical wave-guide while allowing the pad to rotate freely. Removing the vacuum allows the suction hub to be removed from the pad for the purpose of replacing the polishing pad.

The present invention is also an apparatus and technique to allow for determining the exact angular position of the wafer edges as the pad rotates. When the vacuum hub is secured to the pad, it forms the rotating member of an angular position encoder, while the vacuum tube forms the stationary member of the encoder. Electrical power for the angular position encoder is brought in via a cable installed within the vacuum tube, and the encoder's angular position signals are returned via the same cable. The angular encoder signals are used to"home the pad". The technique involves loading the spindle with a wafer and placing it in contact with the rotating polishing pad. By simultaneously tracking the encoder counts and monitoring the reflectance signal for abrupt changes, the wafer's leading and trailing edges can be detected and the corresponding encoder counts saved to memory. The saved encoder count values can then be used to trigger optical analysis equipment at any point along the surface of the wafer as the sensor sweeps beneath it.

The present invention is also an apparatus for precisely locating the polishing pad onto the polishing table by providing locating pins on the table and corresponding locating holes in the polishing pad and waveguide.

Figure 1 shows an isometric view of the vacuum tube (1) connected to the removable vacuum hub (2) located at the center of rotation of a circular polishing pad (4).

An optical waveguide (3) is installed into the pad near the center of the wafer track. The end of the vacuum tube opposite the vacuum hub will normally be attached to a station component of the CMP tool.

Figure 2 depicts a close up isometric cross section of the invention.

In Figure 3, Light coupled into an optical fiber contained within the vacuum tube (1) and terminating in passage (15) is collimated by lens (7). The light is transmitted into the transparent center portion of the pad's wave-guide (14), folded by a mirror (9), and focused by lens (8) into one end of the optical fiber (10), which is embedded in polishing pad (4). The light travels the length of the optical fiber, emerges (Figure 4) from the opposite end of the optical fiber (10), is collimated by lens (12), and reflected upwards, out of the waveguide by mirror (13).

Alternately, In Figure 3, Light coupled into an optical fiber contained within the vacuum tube (1) and terminating in passage (15) is collimated by lens (7). The light is transmitted into the transparent center portion of the pad's wave-guide (14), folded by a mirror (9), and focused by lens (8) into one end of the optical fiber (10), which is embedded in polishing pad (4). The light travels the length of the optical fiber, emerges (Figure 4b) from the opposite end of the optical fiber after traversing a through 90 degree bend.

If a wafer is present parallel to the polishing pad surface and in close proximity to the waveguide, the light emerging from the waveguide will reflect from the wafer and re- enter the waveguide. The reflected light will travel the above mentioned route in reverse and emerge from the end of the optical fiber contained within the vacuum tube, into which the source light was originally coupled. The reflectance can then be analyzed by conventional methods to determine the geometry and and/or composition of the wafer being processed.

Figure 3 also shows a bearing (18) into which vacuum tube (1) is pressed, and around which vacuum hub (2) spins. The vacuum hub end of the vacuum tube contains two other passages in addition the optical fiber passage (15) mentioned above. Passages (16) & (17) are used to accommodate encoder cabling and to port vacuum into the vacuum cavity (22). Also shown are the angular encoder disk (19), the encoder electronics (20), and the polishing pad locating plate (21).

Figure 5 shows an isometric view of the polishing pad locating plate (21) and the two polishing pad locating dowels (23) & (24). Alternately, the locating dowels may be installed directly into the polishing table, if the polishing table cannot accommodate the polishing pad locating plate.

Figure 6 shows a cross-sectional side view of the polishing pad (4) located onto the polishing pad locating plate (21), with the two polishing pad locating dowels (23) & (24) engaging two corresponding holes punched through the polishing pad at the center portion of the optical wave guide (14).