Title:
FIBER-REINFORCED POLYMER ALLOY SUBSTRATE AND MOLDED ARTICLE USING SAME
Document Type and Number:
WIPO Patent Application WO/2020/017392
Kind Code:
A1
Abstract:
This fiber-reinforced polymer alloy substrate, in which continuous reinforcement fibers are arranged in parallel and are impregnated with a polymer alloy, is characterized in that: a polymer alloy obtained by combining thermoplastic resins of at least two types is used as the polymer alloy; the fiber volume content ratio is in the range 40–70% by volume; and the dispersion parameter D of the fibers is at least 90%. In the obtained fiber-reinforced polymer alloy substrate, the reinforcement fibers are dispersed with high homogeneity, and mechanical characteristics and heat resistance are high and expressed stably with low variation.
Inventors:
KOSHI MASAYUKI (JP)
OUCHIYAMA NAOYA (JP)
NARUSE YOSHIHIRO (JP)
OUCHIYAMA NAOYA (JP)
NARUSE YOSHIHIRO (JP)
Application Number:
PCT/JP2019/027109
Publication Date:
January 23, 2020
Filing Date:
July 09, 2019
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08J5/04; B29C70/52; C08K3/04; C08L101/00
Domestic Patent References:
| WO2018061597A1 | 2018-04-05 |
Foreign References:
| JP2008231249A | 2008-10-02 | |||
| JP2003305779A | 2003-10-28 | |||
| JP2013159675A | 2013-08-19 |
Other References:
See also references of EP 3825349A4
Attorney, Agent or Firm:
BAN Toshimitsu et al. (JP)
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