Title:
FIBER-REINFORCED RESIN MOLDING HAVING EMBOSSES AT LEAST ON PART OF SURFACE
Document Type and Number:
WIPO Patent Application WO/2017/115875
Kind Code:
A1
Abstract:
A fiber-reinforced resin molding that comprises a reinforcing fiber having a weight-average fiber length of 100 mm or less and a thermoplastic resin, said fiber-reinforced resin molding being characterized by having embosses at least on a part of the surface thereof, the maximum height (Rz) of the embosses is 100-200 μm, and the average pitch (Rsm) between embosses adjacent to each other is 1100 μm or less.
Inventors:
MITSUNAGA MASAKI (JP)
NOMURA AKIHISA (JP)
NOMURA AKIHISA (JP)
Application Number:
PCT/JP2016/089229
Publication Date:
July 06, 2017
Filing Date:
December 26, 2016
Export Citation:
Assignee:
TEIJIN LTD (JP)
International Classes:
B29C33/42; B29C43/34; B29C43/36; B29C59/02; B29K101/12; B29K105/06
Foreign References:
| JP2003071884A | 2003-03-12 | |||
| JPS63112120A | 1988-05-17 | |||
| JPH0582513U | 1993-11-09 |
Other References:
See also references of EP 3398746A4
Attorney, Agent or Firm:
TAMEYAMA, Taro (JP)
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