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Title:
FIBER-REINFORCED THERMOPLASTIC RESIN MOLDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/131125
Kind Code:
A1
Abstract:
A fiber-reinforced thermoplastic resin molding material which contains reinforcing fiber bundles in a thermoplastic resin, wherein a first constituent unit (I) and a second constituent unit (II) are laminated on each other in such a manner that the first constituent unit (I) is arranged in the surface of the molding material. Provided is a fiber-reinforced thermoplastic resin molding material having excellent mechanical properties and excellent moldability into a complex shape. The first constituent unit (I): a sheet-like material having a heat conductivity (λ1) of 0.2 W/m•K or less; and the second constituent unit (II): a fiber-reinforced thermoplastic resin sheet-like material having a product (B2) of a density and a specific heat of 1.7 × 106 J/m3•K or more.

Inventors:
SEIKE Satoshi (Toray Industries Inc., 9-1, Oe-cho, Minato-ku, Nagoya-sh, Aichi 02, 〒4558502, JP)
TATEYAMA Masaru (Toray Industries Inc., 9-1, Oe-cho, Minato-ku, Nagoya-sh, Aichi 02, 〒4558502, JP)
FUSE Mitsuki (Toray Industries Inc., 9-1, Oe-cho, Minato-ku, Nagoya-sh, Aichi 02, 〒4558502, JP)
Application Number:
JP2018/045650
Publication Date:
July 04, 2019
Filing Date:
December 12, 2018
Export Citation:
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Assignee:
TORAY INDUSTRIES, INC. (1-1 Nihonbashi-Muromachi 2-chome, Chuo-ku Tokyo, 66, 〒1038666, JP)
International Classes:
B32B5/28; B29B11/16; B29B15/08; B29K101/12
Attorney, Agent or Firm:
BAN Toshimitsu et al. (Honest International Patents, Shinko Bldg. 1-9, Nishishinjuku 8-chome, Shinjuku-k, Tokyo 23, 〒1600023, JP)
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