FILAMENT THREE-DIMENSIONAL BONDED BODY MANUFACTURING DEVICE AND FILAMANT THREE-DIMENSIONAL BONDED BODY MANUFACTURING METHOD

WIPO Patent Application WO/2017/119157

A1

Provided is a filament three-dimensional bonded body manufacturing device that is provided with a molten filament supply device for supplying a plurality of molten filaments, a three-dimensional structure forming device for receiving the plurality of molten filaments and cooling and solidifying the same to form a filament three-dimensional bonded body, and a controller for controlling the molten filament supply device and the three-dimensional structure forming device, wherein: the filament three-dimensional bonded body manufacturing device is provided with a hardness index measuring device that measures an index of the hardness of the filament three-dimensional bonded body in a state cooled by the three dimensional structure forming device; and the controller carries out feedback control of at least one of the molten filament supply device and the three-dimensional structure forming device using measurement information fed back from the hardness index measuring device such that changes in the hardness of the filament three-dimensional bonded body formed are controlled.

KOJIMA MASAKAZU (JP)
FUCHIGAMI MASASHI (JP)
MAKINO NARUTAKA (JP)
MIZUNO AKIRA (JP)

PCT/JP2016/077157

July 13, 2017

September 14, 2016

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AIRWEAVE MFG INC (JP)

B29C67/00; D04H3/037; B33Y10/00; B33Y30/00; B33Y50/02; D04H3/14

WO2012035736A1

2012-03-22

JP2016000528A	2016-01-07
JPH11350326A	1999-12-21
US5464491A	1995-11-07

YAMAMOTO Hideo (JP)

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