Title:
FILLER COMPOSITION, SILICONE RESIN COMPOSITION, AND HEAT DISSIPATION COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/153505
Kind Code:
A1
Abstract:
Provided are: a filler composition having excellent heat dissipation properties; a silicone resin composition obtained by using the filler composition; and a heat dissipation component formed by molding the silicone resin composition. More specifically, a filler composition according to the present invention comprises: a filler (A1) having an average particle size of 0.3-1.0 μm; a filler (A2) having an average particle size of 3-15 μm; and a filler (A3) having an average particle size of 35-140 μm, wherein the filler (A1), the filler (A2), and the filler (A3) are at least any one selected from among alumina, magnesia, AIN-coated alumina, AIN, and SN.
Inventors:
SASAKI SHUJI (JP)
NAKAZONO JUNICHI (JP)
TANOUE SHOTARO (JP)
NAKAZONO JUNICHI (JP)
TANOUE SHOTARO (JP)
Application Number:
PCT/JP2020/003573
Publication Date:
July 30, 2020
Filing Date:
January 24, 2020
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C01F7/02; C01B21/072; C08K3/00; C08L83/04
Domestic Patent References:
| WO2019031280A1 | 2019-02-14 |
Foreign References:
| JP2009274929A | 2009-11-26 | |||
| JP2004244491A | 2004-09-02 | |||
| JP2011219309A | 2011-11-04 | |||
| JP2009164093A | 2009-07-23 | |||
| JP2009164093A | 2009-07-23 |
Other References:
See also references of EP 3915939A4
Attorney, Agent or Firm:
KAWAMOTO, Mayumi et al. (JP)
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