Title:
FILLER POWDER AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2014/188991
Kind Code:
A1
Abstract:
The present invention provides a filler powder having a thermal expansion coefficient lower than that of silica powder, and, when the filler powder is blended with a resin, causing minimal change in the properties or color of the resin. A filler powder characterized in comprising a crystallized glass obtained by precipitating a β-quartz solid solution and/or a β-eucryptite solid solution. The average grain size (D50) is preferably no greater than 5 µm. The thermal expansion coefficient within the range of 30-150°C is preferably no greater than 5 × 10-7/°C.
Inventors:
MASUDA NORIAKI (JP)
HOSODA YOHEI (JP)
NAKANE SHINGO (JP)
YAMAZAKI HIROKI (JP)
HOSODA YOHEI (JP)
NAKANE SHINGO (JP)
YAMAZAKI HIROKI (JP)
Application Number:
PCT/JP2014/063176
Publication Date:
November 27, 2014
Filing Date:
May 19, 2014
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
C03C8/04; C03C8/08; C03C8/12; C03C8/14; C03C10/12; C03C10/14
Foreign References:
| JP2007091577A | 2007-04-12 | |||
| JPH04285029A | 1992-10-09 | |||
| JPH04285028A | 1992-10-09 | |||
| JP2010116315A | 2010-05-27 | |||
| JPS6230638A | 1987-02-09 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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