Title:
FILM FOR ACOUSTIC MEMBER
Document Type and Number:
WIPO Patent Application WO/2023/013774
Kind Code:
A1
Abstract:
The present invention is a single-layer film for an acoustic member, the film being curable. The present invention is capable of providing a film for an acoustic member, the film preventing adherence to a die or other mold during molding and being releasable from a mold release film without tearing when peeling the mold release film before molding, while enhancing shape holding properties before molding as well as shaping properties and mold conforming properties during molding.
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Inventors:
HAYAKAWA YUKO (JP)
OSAKI KEISHI (JP)
YAMADA TAKEYOSHI (JP)
OSAKI KEISHI (JP)
YAMADA TAKEYOSHI (JP)
Application Number:
PCT/JP2022/030157
Publication Date:
February 09, 2023
Filing Date:
August 05, 2022
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
H04R7/02; B32B7/022
Domestic Patent References:
| WO2018007372A1 | 2018-01-11 |
Foreign References:
| JP2019171579A | 2019-10-10 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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