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Title:
FILM ADHERING METHOD
Document Type and Number:
WIPO Patent Application WO/2002/092329
Kind Code:
A1
Abstract:
A film adhering method capable of surely adhering a film with a melting temperature different from the melting temperature of a formed body with an adhered part of small area to the formed body without impairing the shape of the formed body, comprising the steps of placing a colorless transparent plastic film (6) on the thin-walled end face (5) of the formed body (1), placing a colorless transparent glass pane (7) on the plastic film, pressing the glass pane, and rotating the adhered part one turn while radiating laser beam (8) on the end face (5), whereby the end face (5) is molten at a radiated point (9) by the laser beam (8) transmitted through the glass pane (7) and the plastic film (6), and the plastic film (6) is adhered to the molten part.

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Inventors:
TAKEDA HIDEAKI (JP)
Application Number:
PCT/JP2002/004064
Publication Date:
November 21, 2002
Filing Date:
April 24, 2002
Export Citation:
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Assignee:
UCHIYA THERMOSTAT (JP)
TAKEDA HIDEAKI (JP)
International Classes:
B29C65/16; B29C65/00; (IPC1-7): B29C65/16
Domestic Patent References:
WO2000007254A12000-02-10
Foreign References:
JP2000218698A2000-08-08
US5893959A1999-04-13
JPH0371991A1991-03-27
US4414166A1983-11-08
US5910260A1999-06-08
Attorney, Agent or Firm:
Osuga, Yoshiyuki (Nibancho Bldg. 8-20, Nibanch, Chiyoda-ku Tokyo, JP)
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