Title:
FILM ADHESIVE, SEMICONDUCTOR PROCESSING SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/169387
Kind Code:
A1
Abstract:
A film adhesive (13) according to the present invention is a curable film adhesive. A single layer of the film adhesive (13) that has a thickness of 60 µm and that is uncured, or a laminate formed by stacking two or more layers of the film adhesive (13), which is uncured, so as to have a total thickness of 60 µm, has a rupture elongation of 60% or less at the temperature of 0°C, and the adhesiveness of the uncured film adhesive (13) to a semiconductor wafer is 300 mN/25 mm or higher. A semiconductor processing sheet (1) according to the present invention is formed by providing the film adhesive (13) on a support sheet (10) having a base material (11).
Inventors:
NAKAAKI NATSUKI (JP)
SATO AKINORI (JP)
TSUCHIYAMA SAYAKA (JP)
SUZUKI HIDEAKI (JP)
SATO AKINORI (JP)
TSUCHIYAMA SAYAKA (JP)
SUZUKI HIDEAKI (JP)
Application Number:
PCT/JP2017/007083
Publication Date:
October 05, 2017
Filing Date:
February 24, 2017
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; B23K26/53; C09J7/20; C09J201/00; H01L21/683
Domestic Patent References:
| WO2004109786A1 | 2004-12-16 |
Foreign References:
| JP2015198116A | 2015-11-09 | |||
| JP2002226796A | 2002-08-14 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
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