FILM ATTACHMENT APPARATUS AND ATTACHMENT METHOD

WIPO Patent Application WO/2011/161861

A1

Disclosed is a film attachment apparatus (1) which detaches a paste surface protection sheet (2b) from a film (2) that has been separated in a state in which the paste surface protection sheet (2b) is temporarily attached to an adhesive surface, and which attaches the film (2) to a panel (3), wherein the film attachment apparatus (1) comprises: a pressing stage (22) which presses the film (2) from above the film (2); a pressing part (24) which presses the end part of the paste surface protection sheet (2b) from below to thereby bend and raise and thus detach the end part of the paste surface protection sheet (2b) from the film (2), and which first detaches the paste surface protection sheet (2b); an attachment head (81) which is rotatable around a support shaft (82) and also has a convex surface facing the paste surface protection sheet (2b), and which holds the film (2) from which the paste surface protection sheet (2b) has been first detached; and a detachment tape (41) which detaches the entirety of the paste surface protection sheet (2b) from the film (2) held by the attachment head (81). The workability of attachment operations can therefore be improved.

CHIDA, Masao (4-10-27, Higashi-shinagawa, Shinagawa-k, Tokyo 02, 〒1400002, JP)
千田　昌男 (〒02 東京都品川区東品川四丁目１０番２７号ＮＥＣエンジニアリング株式会社内 Tokyo, 〒1400002, JP)

JP2011/002217

December 29, 2011

April 14, 2011

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NEC Engineering, Ltd. (4-10-27, Higashi-shinagawa Shinagawa-k, Tokyo 02, 〒1400002, JP)
ＮＥＣエンジニアリング株式会社 (〒02 東京都品川区東品川四丁目１０番２７号 Tokyo, 〒1400002, JP)
CHIDA, Masao (4-10-27, Higashi-shinagawa, Shinagawa-k, Tokyo 02, 〒1400002, JP)

B29C65/78; B29C65/48; G02F1/1335; G09F9/00

IEIRI, Takeshi (HIBIKI IP Law Firm, Asahi Bldg. 10th Floor 3-33-8, Tsuruya-cho, Kanagawa-ku, Yokohama-sh, Kanagawa 35, 〒2210835, JP)

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