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Patent Searching and Data


Title:
FILM FOR BACK SURFACE OF SEMICONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2017/047183
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a protective film for a semiconductor, with which it is possible to prevent warpage of semiconductor wafers and semiconductor chips and to prevent chipping and reflow cracking from occurring. This protective film for a semiconductor is characterized by comprising a metal layer to be laminated onto the back surface of a semiconductor chip and an adhesive layer for affixing the metal layer to the back surface of the semiconductor chip, and is characterized in that the surface free energy of a surface of the adhesive layer on the side to be affixed to the semiconductor chip and that of a surface of the adhesive layer on the side to be affixed to the metal layer are both at least 35 mJ/m2, and the peel force between the adhesive layer and the metal layer in a B stage is at least 0.3 N/25 mm.

Inventors:
SUGIYAMA JIROU (JP)
AOYAMA MASAMI (JP)
Application Number:
PCT/JP2016/068031
Publication Date:
March 23, 2017
Filing Date:
June 17, 2016
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L23/00; B32B27/00; C09J7/28; C09J201/00; H01L21/301; H01L21/683
Domestic Patent References:
WO2015076236A12015-05-28
Foreign References:
JPH1167699A1999-03-09
US20100109156A12010-05-06
Attorney, Agent or Firm:
MATSUSHITA, Makoto et al. (JP)
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