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Patent Searching and Data


Title:
FILM BONDING DEVICE AND FILM BONDING UNIT
Document Type and Number:
WIPO Patent Application WO/2017/002741
Kind Code:
A1
Abstract:
The present invention provides a film bonding device that enables a film bonding method by which intrusion of foreign matter and air bubbles in a bonding surface can be prevented even in a case where the bonding process is performed in a normal environment where foreign matter, such as dust, is floating. The film bonding device according to the present invention is used in a method that involves bonding a functional film onto a region in which a foreign-matter removal film has been peeled off from a base material while peeling off the foreign-matter removal film bonded to the base material. The film bonding device has a securing section that secures the film bonding device, a bonding section configured to be movable along a film bonding region while pressing the functional film disposed in the film bonding region of the base material against the base material, a winding section that is disposed at one end of the bonding section in the moving direction thereof and that winds up the foreign-matter removal film bonded to the film bonding region so as to peel off the foreign-matter removal film, and a pulling section that is disposed above the winding section and that controls the tension applied to the functional film.

Inventors:
YAMADA, Nobuaki
Application Number:
JP2016/068944
Publication Date:
January 05, 2017
Filing Date:
June 27, 2016
Export Citation:
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Assignee:
SHARP KABUSHIKI KAISHA (22-22, Nagaike-cho Abeno-ku, Osaka-sh, Osaka 22, 〒5458522, JP)
International Classes:
B32B37/16; B32B37/02; B65C1/02; B65C9/36; C09J7/02; C09J201/00
Foreign References:
JP2012048046A2012-03-08
JP2011245772A2011-12-08
JP2010286664A2010-12-24
JPH0850290A1996-02-20
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (5-36, Miyahara 3-chome Yodogawa-ku, Osaka-sh, Osaka 03, 〒5320003, JP)
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