Title:
FILM BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/094622
Kind Code:
A1
Abstract:
Provided is a film bonding method suitable for achieving a narrower bezel in an image display device. This film bonding method is for bonding a sensor film and an optical film, the film bonding method comprising: disposing, on one surface of the sensor film, electrodes and lead wires which are connected to the electrodes; and after aligning the position of the optical film with reference to the lead wires, bonding the sensor film and the optical film.
Inventors:
UMEMOTO TORU (JP)
KAWAMOTO IKUO (JP)
KAWAMOTO IKUO (JP)
Application Number:
PCT/JP2016/085027
Publication Date:
June 08, 2017
Filing Date:
November 25, 2016
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
G06F3/041; G02F1/1333; G02F1/1335; G09F9/00; G02B5/30
Foreign References:
| JP2013145261A | 2013-07-25 | |||
| JP2000180810A | 2000-06-30 | |||
| JP2014119984A | 2014-06-30 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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