FILM BULK ACOUSTIC RESONATOR AND PREPARATION METHOD THEREFOR, AND FILTER

WIPO Patent Application WO/2021/102813

A1

Provided are a film bulk acoustic resonator and a preparation method therefor, and a filter. The film bulk acoustic resonator comprises a substrate and a piezoelectric oscillation structure. The piezoelectric oscillation structure comprises a bottom electrode, a piezoelectric film layer, and a top electrode, which are sequentially formed on the top surface of the substrate. The bottom electrode is covered by the piezoelectric film layer, on which a through hole is formed, and the bottom electrode is guided, through a conductor in the through hole, to a top surface of the piezoelectric film layer that is far away from the substrate. The top surface of the substrate is provided with a groove, which is filled with a conductive block, and the conductive block is in contact with the bottom electrode, wherein an orthographic projection of the through hole to the substrate is in the range of a region in which the groove is located, and the bottom electrode at least partially covers the groove. The film bulk acoustic resonator provided in the embodiments of the present application can have a high reliability.

SUN CHENGLIANG (CN)
ZOU YANG (CN)
CAI YAO (CN)
ZHOU JIE (CN)
LIU YAN (CN)
GAO CHAO (CN)
LIU PENG (CN)

PCT/CN2019/121650

June 03, 2021

November 28, 2019

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HUAWEI TECH CO LTD (CN)

H03H9/17; H03H9/02

CN110198158A	2019-09-03
CN110198158A	2019-09-03
CN110168933A	2019-08-23
CN110401428A	2019-11-01
CN207869079U	2018-09-14

BEIJING RUN ZEHENG INTELLECTUAL PROPERTY LAW FIRM (CN)

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