Title:
FILM BULK ACOUSTIC WAVE RESONATOR AND MANUFACTURING METHOD THEREFOR, AND FILTER
Document Type and Number:
WIPO Patent Application WO/2020/097829
Kind Code:
A1
Abstract:
The present disclosure provides a film bulk acoustic wave resonator and a manufacturing method therefor, and a filter. The film bulk acoustic wave resonator comprises: a substrate; a piezoelectric stack structure formed on the substrate, the piezoelectric stack structure comprising a bottom electrode, a piezoelectric film, and a top electrode; as well as a first pad and a second pad formed on the piezoelectric stack structure. The film bulk acoustic wave resonator further comprises a dielectric layer, formed on an etched end surface of the piezoelectric film and/or formed on etched end surfaces of the piezoelectric film and the bottom electrode, and/or formed on etched end surfaces of the piezoelectric film and the top electrode, and/or formed on etched end surfaces of the piezoelectric film, the top electrode, and the bottom electrode. The film bulk acoustic wave resonator and the manufacturing method therefor, and the filter of the present disclosure improve the device performance, simplify the manufacturing process, and reduce the manufacturing cost.
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Inventors:
LI PING (CN)
WANG WEI (CN)
HU NIANCHU (CN)
JIA BIN (CN)
WANG WEI (CN)
HU NIANCHU (CN)
JIA BIN (CN)
Application Number:
PCT/CN2018/115445
Publication Date:
May 22, 2020
Filing Date:
November 14, 2018
Export Citation:
Assignee:
EPICMEMS XIAMEN CO LTD (CN)
International Classes:
H04R17/00
Foreign References:
| US20040172798A1 | 2004-09-09 | |||
| CN1864326A | 2006-11-15 | |||
| CN206673927U | 2017-11-24 | |||
| CN105897211A | 2016-08-24 |
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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