Title:
FILM CAPACITOR AND FILM FOR FILM CAPACITORS
Document Type and Number:
WIPO Patent Application WO/2021/132257
Kind Code:
A1
Abstract:
This film capacitor 10 is provided with: a dielectric resin film (for example, a first dielectric resin film 13) which is formed of a cured product of a first organic material and a second organic material; and a metal layer (for example, a first metal layer 15) which is arranged on at least one surface of the dielectric resin film. The first organic material is composed of an organic polymer that has a hydroxyl group and a benzene ring in a repeating unit. The second organic material is composed of diphenylmethane diisocyanate, a modified diphenylmethane diisocyanate or a mixture thereof. Among the linear expansion coefficients of the above-described film based on that at 0°C, if α40°C is the linear expansion coefficient at 40°C, α80°C is the linear expansion coefficient at 80°C and α120°C is the linear expansion coefficient at 120°C, the value of α40°C/α80°C is 1.05 or more, and the value of α80°C/α120°C is 1.1 or more.
Inventors:
INAKURA TOMOKI (JP)
ICHIKAWA TOMOMICHI (JP)
ICHIKAWA TOMOMICHI (JP)
Application Number:
PCT/JP2020/047994
Publication Date:
July 01, 2021
Filing Date:
December 22, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/32
Domestic Patent References:
| WO2019097750A1 | 2019-05-23 | |||
| WO2018142922A1 | 2018-08-09 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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