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Patent Searching and Data


Title:
FILM CAPACITOR AND METALIZED FILM
Document Type and Number:
WIPO Patent Application WO/2019/097750
Kind Code:
A1
Abstract:
This film capacitor is provided with a metalized film comprising a metal layer provided on one surface of a dielectric resin film, and is characterized in that, when αP is defined as the coefficient of thermal expansion of the metalized film and αM as the coefficient of thermal expansion of the metal layer, the value of αP/αM is less than or equal to 5.1.

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Inventors:
ICHIKAWA TOMOMICHI (JP)
INAKURA TOMOKI (JP)
KOBAYASHI SHINICHI (JP)
Application Number:
PCT/JP2018/022889
Publication Date:
May 23, 2019
Filing Date:
June 15, 2018
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/32; B32B7/02; B32B15/08
Domestic Patent References:
WO2013128726A12013-09-06
Foreign References:
JPH03241804A1991-10-29
JP2008088387A2008-04-17
JP2017183461A2017-10-05
JP2003160727A2003-06-06
JP5794380B22015-10-14
Other References:
"THE ENGINEER'S BOOK", vol. 19, TECHNICAL DATA COLLECTION (HEISHIN LTD.
See also references of EP 3671780A1
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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