FILM FOR CONDUCTIVE SURFACE MOUNT TERMINAL AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2012/026628

A1

The present invention provides a film for a conductive surface mount terminal. The film for the conductive surface mount terminal of the present invention comprises a heat-resistant film and a metal layer which is formed by contact to the surface of the heat-resistant film, or comprises a first metal layer, a heat-resistant film which is formed by contact to the surface of the first metal layer, and a second metal layer which is formed by contact to the other surface of the metal layer. The film for the conductive surface mount terminal of the present invention smoothly couples to tin ingredients in molten solder cream during a reflow soldering process, preventing slipping of the terminal and thereby allowing the seating of the conductive surface mount terminal at the correct position. As a result, when a terminal, to which the film for the conductive surface mount terminal of the present invention is formed, is applied to a substrate, less negative impact is made on electricity flow or fine signals, thereby reducing erroneous operation of electronic devices.

LEE HWAN KU (KR)
HWANG TAE JO (KR)
PARK JUNG-DUCK (KR)
LEE SANG WON (KR)
LIM EUN-A (KR)
CHUNG CHUL-HWA (KR)

PCT/KR2010/005592

March 01, 2012

August 23, 2010

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DOOSUNG IND CO LTD (KR)
LEE HWAN KU (KR)
HWANG TAE JO (KR)
PARK JUNG-DUCK (KR)
LEE SANG WON (KR)
LIM EUN-A (KR)
CHUNG CHUL-HWA (KR)

H05K1/03; H01B5/14; H01L21/60; H05K1/09; H05K3/38

KR20080006321A	2008-01-16
KR20090018015A	2009-02-19
JP2003151668A	2003-05-23
JPH11135226A	1999-05-21

LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)
특허법인 리온 (KR)

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