Title:
FILM CUTTING METHOD AND FILM CUTTING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2013/151097
Kind Code:
A1
Abstract:
This film cutting method comprises winding off a film (F) from a bulk roll (7) around which a roll of the film (F) has been wound, conveying the film (F) to a set cutting region (AR1) on a path of conveyance of the film (F), calculating a tilt angle (θ) of an edge of the film in the cutting region (AR1) in relation to the direction of conveyance of the film (F), adjusting a cutting angle (α) in relation to the direction of conveyance of the film (F) on the basis of the calculated tilt angle (θ), and cutting the film (F) in the cutting region (AR1) at the adjusted cutting angle (α).
Inventors:
MATSUMOTO RIKIYA (JP)
OIKAWA SHIN (JP)
NISHIHARA NOBUHIKO (JP)
OIKAWA SHIN (JP)
NISHIHARA NOBUHIKO (JP)
Application Number:
PCT/JP2013/060223
Publication Date:
October 10, 2013
Filing Date:
April 03, 2013
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
B26D5/34; B26D3/00; B26D5/02
Foreign References:
| JP2007283429A | 2007-11-01 | |||
| JP2007283440A | 2007-11-01 | |||
| JP2002370194A | 2002-12-24 | |||
| JP2001009788A | 2001-01-16 | |||
| JPH0543095A | 1993-02-23 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Sumio Tanai (JP)
Sumio Tanai (JP)
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