Title:
FILM FORMATION DEVICE AND FILM FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2018/037921
Kind Code:
A1
Abstract:
A film formation unit applies a film material to a substrate to form a film. An imaging device images the surface of the substrate provided in the film formation unit. A control unit controls the film formation unit. The control unit has, stored therein, pattern data defining the planar shape of the film to be formed. Before the film is formed on the basis of the pattern data, the control unit forms an evaluation pattern by causing the film material to be discharged on a portion inside an area where the film material is to be applied in order to form the film. The quality of the surface state of the substrate is determined on the basis of an image of the evaluation pattern captured by the imaging device, and different processing is executed on the basis of the determination result.
Inventors:
OKAMOTO YUJI (JP)
Application Number:
PCT/JP2017/028964
Publication Date:
March 01, 2018
Filing Date:
August 09, 2017
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B05C11/00; B05C5/00; B05C11/10; B05D1/26; B05D1/36; B05D3/00; G01B11/24; G01N21/956
Foreign References:
| JP2009241534A | 2009-10-22 | |||
| JP2015074114A | 2015-04-20 | |||
| JP2016022650A | 2016-02-08 | |||
| JP2015016426A | 2015-01-29 | |||
| JP2014008436A | 2014-01-20 |
Attorney, Agent or Firm:
KITAYAMA, Mikio (JP)
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