Title:
FILM FORMATION DEVICE AND FILM FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/208035
Kind Code:
A1
Abstract:
A film formation device is equipped with: a target holding unit for holding a target from which sputtered particles are to be emitted in a processing space in a processing chamber; a sputtered particle emission means for emitting the sputtered particles from the target; a sputtered particle blocking plate having through-holes through which the sputtered particles can pass; a blocking member which is arranged so as to block the through-holes; a transportation mechanism for moving the blocking member in the horizontal direction; and a control unit. The control unit enables the sputtered particles to be emitted from the target while controlling the blocking member, which has a substrate mounted on a mount section provided therein, so as to move in one horizontal direction. The sputtered particles that pass through the through-holes are accumulated on the substrate.
Inventors:
SHINADA MASATO (JP)
TOSHIMA HIROYUKI (JP)
ABARRA NOEL (JP)
TOSHIMA HIROYUKI (JP)
ABARRA NOEL (JP)
Application Number:
PCT/JP2019/011725
Publication Date:
October 31, 2019
Filing Date:
March 20, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
C23C14/34; H01L21/68
Domestic Patent References:
| WO2010116560A1 | 2010-10-14 |
Foreign References:
| JPH11189874A | 1999-07-13 | |||
| JP2016033266A | 2016-03-10 | |||
| JP2012517701A | 2012-08-02 |
Attorney, Agent or Firm:
TAKAYAMA Hiroshi (JP)
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