Title:
FILM FORMATION DEVICE AND PLACEMENT STAND USED THEREIN
Document Type and Number:
WIPO Patent Application WO/2019/181438
Kind Code:
A1
Abstract:
This film formation device for using plasma to form a predetermined film on a to-be-processed body is provided with: a processing container that accommodates a to-be-processed body; a placement stand on which the to-be-processed body is placed inside the processing container; a processing gas introduction mechanism for introducing into the processing container a processing gas for film formation; and a plasma generation mechanism for generating plasma inside the processing container, wherein the placement stand is provided with: a placement stand body having a to-be-processed body placement region on the top surface thereof; and a control member for controlling the plasma, the control member being provided in an annular shape to surround the to-be-processed body placement region, and having a greater height than the to-be-processed body placed in the to-be-processed body placement region.
Inventors:
LI JINWANG (JP)
OBA DAISUKE (JP)
IKUTA HIROYUKI (JP)
MORISADA YOSHINORI (JP)
GUNJI ISAO (JP)
KOMIYA TAKAYUKI (JP)
UEDA HIROKAZU (JP)
OBA DAISUKE (JP)
IKUTA HIROYUKI (JP)
MORISADA YOSHINORI (JP)
GUNJI ISAO (JP)
KOMIYA TAKAYUKI (JP)
UEDA HIROKAZU (JP)
Application Number:
PCT/JP2019/008093
Publication Date:
September 26, 2019
Filing Date:
March 01, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
C23C16/458; H01L21/31; H05H1/46
Foreign References:
| JPH07106316A | 1995-04-21 | |||
| JP2002241946A | 2002-08-28 | |||
| JP2005277369A | 2005-10-06 | |||
| JPH08339895A | 1996-12-24 |
Attorney, Agent or Firm:
TAKAYAMA Hiroshi (JP)
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