Title:
FILM FORMATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/099205
Kind Code:
A1
Abstract:
Disclosed is a film formation device which is easier to manufacture than conventional devices and which is capable of uniformly supplying a source gas to the surface of a substrate. The disclosed film formation device for forming thin films is provided with a first electrode (3) with a substrate (4) thereon, and a second electrode (2) which faces the substrate (4) and to which a high-frequency voltage is applied. The second electrode (2) has a shower plate (9) on a surface facing the substrate (4), and has one mesh plate (10) on a surface of the shower plate (9) which faces the substrate (4). The shower plate (9) has multiple holes (9a) through which the source gas is passed, and the mesh plate (10) has a mesh structure for passing the source gas (5) which has passed through the holes (9a) in the shower plate (9). Between the mesh plate (10) and the substrate (4), a space is provided in which plasma is generated.
Inventors:
MATSUYAMA HIDEAKI (JP)
Application Number:
PCT/JP2010/070345
Publication Date:
August 18, 2011
Filing Date:
November 16, 2010
Export Citation:
Assignee:
FUJI ELECTRIC HOLDINGS (JP)
MATSUYAMA HIDEAKI (JP)
MATSUYAMA HIDEAKI (JP)
International Classes:
C23C16/455; H01L21/205
Foreign References:
| JP2007327097A | 2007-12-20 | |||
| JP2002105645A | 2002-04-10 |
Attorney, Agent or Firm:
OKUYAMA, Shoichi et al. (JP)
Okuyama In addition, it is 1. (JP)
Okuyama In addition, it is 1. (JP)
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Claims: