Title:
FILM FORMATION METHOD, FILM FORMATION DEVICE, SUSCEPTOR UNIT, AND SPACER SET USED IN SUSCEPTOR UNIT
Document Type and Number:
WIPO Patent Application WO/2020/116618
Kind Code:
A1
Abstract:
This film formation method includes: the placement of a wafer on a susceptor unit that includes a support member for mounting the wafer, a side surface guide that is provided upon the support member and surrounds at least part of the outer circumference of the wafer, and a spacer for adjusting the position of the upper surface of the wafer and the upper surface of the side surface guide; the formation of a prescribed film on the upper surface of the mounted wafer and the formation of a film upon the side surface guide; the adjustment of the position of the upper surface of the side surface guide relative to the upper surface of the wafer, using the spacer and on the basis of the thickness of the prescribed film that has been formed; and the mounting of a new wafer on the position-adjusted susceptor unit and the formation of a new prescribed film.
Inventors:
DAIGO YOSHIAKI (JP)
Application Number:
PCT/JP2019/047840
Publication Date:
June 11, 2020
Filing Date:
December 06, 2019
Export Citation:
Assignee:
NUFLARE TECHNOLOGY INC (JP)
International Classes:
H01L21/205; C23C16/458; C23C16/52
Foreign References:
| JP2017228708A | 2017-12-28 | |||
| JP2008244274A | 2008-10-09 | |||
| JP2001274104A | 2001-10-05 | |||
| JP2006319043A | 2006-11-24 | |||
| JP2005277369A | 2005-10-06 | |||
| JP2011258859A | 2011-12-22 | |||
| JP2007180153A | 2007-07-12 |
Other References:
See also references of EP 3893268A4
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
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