Title:
FILM FORMING AID COMPOSITION FOR EMULSION RESIN
Document Type and Number:
WIPO Patent Application WO/2015/059796
Kind Code:
A1
Abstract:
This film forming aid composition for an emulsion resin is characterized by comprising a specific ester compound (A) and a specific fatty acid (B), and having an acid value of 0.05 to 5 mgKOH/g. The film forming aid composition has low odor, a high boiling point, and excellent film forming properties, and the emulsion resin incorporating the film forming aid composition has favorable long term storage stability.
Inventors:
ONO TAKASHI (JP)
SHIRAI HIROAKI (JP)
HOSAKA MASAKI (JP)
SHIRAI HIROAKI (JP)
HOSAKA MASAKI (JP)
Application Number:
PCT/JP2013/078823
Publication Date:
April 30, 2015
Filing Date:
October 24, 2013
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C08K5/10; C08K5/09; C08L33/00; C08L75/04; C09D7/63; C09D133/00; C09D175/04; C09J11/06; C09J133/00; C09J175/04
Foreign References:
| JP2005200611A | 2005-07-28 | |||
| JP2002053817A | 2002-02-19 | |||
| JP2000103930A | 2000-04-11 | |||
| JP2005200611A | 2005-07-28 |
Other References:
See also references of EP 3061787A4
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
Michiharu Soga (JP)
Michiharu Soga (JP)
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