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Patent Searching and Data


Title:
FILM FORMING APPARATUS, FILM FORMING METHOD, COMPUTER PROGRAM AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2007/142329
Kind Code:
A1
Abstract:
In a film forming method, a subject to be processed is transferred into a processing chamber which can be vacuumized. At least a transition metal containing material gas including a transition metal and a reducing gas are supplied into a processing container, and the subject to be processed is heated. Then, a thin film is formed in a recessed portion on the surface of the subject by heat treatment. Thus, the recessed portion on the surface of the subject can be filled with a copper film.

Inventors:
MATSUMOTO KENJI (JP)
KOIKE JUNICHI (JP)
NEISHI KOJI (JP)
Application Number:
PCT/JP2007/061637
Publication Date:
December 13, 2007
Filing Date:
June 08, 2007
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
MATSUMOTO KENJI (JP)
KOIKE JUNICHI (JP)
NEISHI KOJI (JP)
International Classes:
C23C16/18; H01L21/285; H01L21/3205; H01L23/52
Foreign References:
JPH11200048A1999-07-27
JP2005248231A2005-09-15
JP2005277390A2005-10-06
JP2006128288A2006-05-18
JP2006073863A2006-03-16
JP2001244265A2001-09-07
Attorney, Agent or Firm:
YOSHITAKE, Kenji et al. (Room 323 Fuji Bldg.,2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo 05, JP)
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