Title:
FILM-FORMING APPARATUS AND FILM-FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2004/104262
Kind Code:
A1
Abstract:
A film-forming apparatus and a film-forming method are disclosed wherein a high-frequency voltage from an HF power supply (11) is applied to a cathode (5) whose back surface is provided with a permanent magnet (10) to generate a plasma in a reactive mode and a film is formed through plasma polymerization using the thus-generated plasma. By regulating the pressure of a plasma source gas within a vacuum chamber (1), a plasma not in the reactive mode but in the metallic mode is generated and a film is formed through magnetron sputtering, wherein the cathode (5) is the sputtering target, using the thus-generated plasma.
Inventors:
NOSE KOICHI
SASAGAWA KOICHI
FURUTSUKA TAKESHI
TAKIGAWA SHIRO
KOIZUMI YASUHIRO
SASAGAWA KOICHI
FURUTSUKA TAKESHI
TAKIGAWA SHIRO
KOIZUMI YASUHIRO
Application Number:
PCT/JP2004/007438
Publication Date:
December 02, 2004
Filing Date:
May 25, 2004
Export Citation:
Assignee:
SHINMAYWA IND LTD (JP)
NOSE KOICHI
SASAGAWA KOICHI
FURUTSUKA TAKESHI
TAKIGAWA SHIRO
KOIZUMI YASUHIRO
NOSE KOICHI
SASAGAWA KOICHI
FURUTSUKA TAKESHI
TAKIGAWA SHIRO
KOIZUMI YASUHIRO
International Classes:
C23C14/00; (IPC1-7): C23C14/12; F21S8/10; F21V7/22
Foreign References:
| JPS6122430A | 1986-01-31 | |||
| JP2001316827A | 2001-11-16 | |||
| JPH10195951A | 1998-07-28 | |||
| JPS6485102A | 1989-03-30 | |||
| JP2003080625A | 2003-03-19 | |||
| JP2002192651A | 2002-07-10 | |||
| JP2004035935A | 2004-02-05 |
Other References:
See also references of EP 1681367A4
Attorney, Agent or Firm:
Sumida, Yoshihiro (Bo-eki Bldg. 123-1, Higashi-machi, Chuo-ku, Kobe-sh, Hyogo 31, JP)
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