Title:
FILM FORMING APPARATUS AND FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2007/148692
Kind Code:
A1
Abstract:
A film forming apparatus is provided with a chamber which partitions a processing space
for performing film forming process to a substrate; a stage arranged in the chamber
for placing the substrate; a substrate heating means arranged on the stage for
heating the substrate; a shower head which is arranged to face the stage and has
many gas jetting holes; a gas supplying mechanism for supplying the chamber with
a processing gas through the shower head; a cooling means arranged above the shower
head for cooling the shower head; and a shower head heating means arranged above
the cooling means for heating the shower head through the cooling means.
Inventors:
KAKEGAWA TAKASHI (JP)
Application Number:
PCT/JP2007/062328
Publication Date:
December 27, 2007
Filing Date:
June 19, 2007
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
KAKEGAWA TAKASHI (JP)
KAKEGAWA TAKASHI (JP)
International Classes:
C23C16/455; H01L21/28; H01L21/285
Domestic Patent References:
| WO2005119749A1 | 2005-12-15 | |||
| WO2005045913A1 | 2005-05-19 |
Foreign References:
| JP2002053963A | 2002-02-19 | |||
| JP2004100001A | 2004-04-02 | |||
| JP2002327274A | 2002-11-15 |
Attorney, Agent or Firm:
YOSHITAKE, Kenji et al. (Room 323 Fuji Bldg.,2-3, Marunouchi 3-chome, Chiyoda-ku Tokyo 05, JP)
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