Title:
FILM FORMING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/170387
Kind Code:
A1
Abstract:
This film forming apparatus is provided with: a die device that extrudes molten resin in a tubular shape to form a film; a measurement unit that measures a film thickness profile in a circumferential direction; a plurality of adjustment units that change the film thickness profile; and a control device 7 that controls the plurality of adjustment units such that the thickness profile is close to a target thickness profile, wherein the control device 7 changes the target thickness profile on the basis of the measured thickness profile.
Inventors:
NAKANO KATSUYUKI (JP)
Application Number:
PCT/JP2017/012369
Publication Date:
October 05, 2017
Filing Date:
March 27, 2017
Export Citation:
Assignee:
SUMITOMO HEAVY IND MODERN LTD (JP)
International Classes:
B29C48/08; B29C48/10; B29C48/32; B29C48/325; B29C48/92; B29L7/00
Foreign References:
| JPH09225995A | 1997-09-02 | |||
| JP2001310372A | 2001-11-06 | |||
| JP2005186377A | 2005-07-14 | |||
| JPH08276491A | 1996-10-22 |
Other References:
See also references of EP 3437827A4
Attorney, Agent or Firm:
MORISHITA Sakaki (JP)
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