FILM FORMING COMPOSITION, FILM, CIRCUIT SHEET, AND SENSOR SHEET

Title:

FILM FORMING COMPOSITION, FILM, CIRCUIT SHEET, AND SENSOR SHEET

Document Type and Number:

WIPO Patent Application WO/2022/210690

Kind Code:

A1

Abstract:

A film that protects circuit wiring or a sensor electrode of a circuit sheet or a sensor sheet is formed, said protective film having been made thinner and having a superior ability to protect the circuit wiring or the sensor electrode. Additionally, a film forming composition that is for forming said film is obtained. The film forming composition includes a cycloolefin polymer, a physical property adjustment material, and a solvent. The film comprises said film forming composition.

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Inventors:

MIYANAGA KANAE (JP)
KEKURA YU (JP)

Application Number:

PCT/JP2022/015387

Publication Date:

October 06, 2022

Filing Date:

March 29, 2022

Export Citation:

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Assignee:

SEKISUI POLYMATECH CO LTD (JP)

International Classes:

C08L45/00; C09D145/00; G06F3/041; H05K1/02; H05K3/28

Domestic Patent References:

WO2019159953A1

2019-08-22

Foreign References:

JP2007084764A	2007-04-05
JPH0543834A	1993-02-23
JPH08259784A	1996-10-08