Title:
FILM-FORMING COMPOSITION CONTAINING SILICON COMPOUND
Document Type and Number:
WIPO Patent Application WO/2011/049078
Kind Code:
A1
Abstract:
Provided is a film-forming composition which contains a silicon compound (A) having a partial structure represented by general formula (1) and which attains excellent flatness. Specifically provided is a composition which is intended to be used in a process for the formation of a pattern by nanoimprint lithography and which can form a resist upper-layer film by thermal firing and/or light irradiation on a resist for nanoimprining. In general formula (1), R1s are each C1-10 alkyl, C6-20 aryl, or a combination of the same; R2 is a polymerizable organic group; and n1 is an integer of 1 to 10.
Inventors:
TAKEI SATOSHI (JP)
Application Number:
PCT/JP2010/068351
Publication Date:
April 28, 2011
Filing Date:
October 19, 2010
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
TAKEI SATOSHI (JP)
TAKEI SATOSHI (JP)
International Classes:
C09D183/04; B05D7/24; C08F299/08; C08G59/20; C08G77/38; C08L83/04; C09D7/12; C09D183/06; C09D183/07; H01L21/027
Foreign References:
| US20020035199A1 | 2002-03-21 | |||
| JPH0598016A | 1993-04-20 | |||
| JP2006299099A | 2006-11-02 |
Attorney, Agent or Firm:
HANABUSA, Tsuneo et al. (JP)
Sepal Tsuneo (JP)
Sepal Tsuneo (JP)
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