Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FILM-FORMING COMPOSITION CONTAINING SILICON COMPOUND
Document Type and Number:
WIPO Patent Application WO/2011/049078
Kind Code:
A1
Abstract:
Provided is a film-forming composition which contains a silicon compound (A) having a partial structure represented by general formula (1) and which attains excellent flatness. Specifically provided is a composition which is intended to be used in a process for the formation of a pattern by nanoimprint lithography and which can form a resist upper-layer film by thermal firing and/or light irradiation on a resist for nanoimprining. In general formula (1), R1s are each C1-10 alkyl, C6-20 aryl, or a combination of the same; R2 is a polymerizable organic group; and n1 is an integer of 1 to 10.

Inventors:
TAKEI, Satoshi (Electronic Materials Research Laboratories, 488-6, Suzumi-cho, Funabashi-sh, Chiba 52, 〒2740052, JP)
Application Number:
JP2010/068351
Publication Date:
April 28, 2011
Filing Date:
October 19, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NISSAN CHEMICAL INDUSTRIES, LTD. (7-1 Kanda-Nishiki-cho 3-chome, Chiyoda-ku Tokyo, 54, 〒1010054, JP)
日産化学工業株式会社 (〒54 東京都千代田区神田錦町3丁目7番地1 Tokyo, 〒1010054, JP)
International Classes:
C09D183/04; B05D7/24; C08F299/08; C08G59/20; C08G77/38; C08L83/04; C09D7/12; C09D183/06; C09D183/07; H01L21/027
Foreign References:
US20020035199A1
JPH0598016A
JP2006299099A
Attorney, Agent or Firm:
HANABUSA, Tsuneo et al. (Shin-Ochanomizu Urban Trinity 2, Kandasurugadai 3-chome, Chiyoda-k, Tokyo 62, 〒1010062, JP)
Download PDF: