Title:
FILM-FORMING DEVICE AND METHOD FOR CLEANING SAME
Document Type and Number:
WIPO Patent Application WO/2018/193664
Kind Code:
A1
Abstract:
A method for cleaning a film-forming device that: feeds a raw material gas into a processing container, which has a substrate holding unit for holding an SiC substrate provided in the interior and in which the pressure in the interior is reduced; heats the SiC substrate; and forms a film on the SiC substrate, the method including: a reaction product removal step for removing a reaction product that was produced during film formation and adhered to portions other than the SiC substrate, the reaction product being removed by feeding a ClF3 gas into the processing container after film formation; and a residue removal step for removing substances that remain after the reaction product removal step and that could become a factor of a defect or that are impurities not required for the next film formation, the substances being removed by feeding air into the processing container.
More Like This:
Inventors:
HARASHIMA MASAYUKI (JP)
SANO YUKIO (JP)
SANO YUKIO (JP)
Application Number:
PCT/JP2017/045681
Publication Date:
October 25, 2018
Filing Date:
December 20, 2017
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/205; C23C16/44
Foreign References:
| JP2007243014A | 2007-09-20 | |||
| JP2015040153A | 2015-03-02 | |||
| JP2013251487A | 2013-12-12 | |||
| US20130192648A1 | 2013-08-01 | |||
| JPH0348268U | 1991-05-08 |
Other References:
See also references of EP 3614419A4
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Download PDF: