FILM-FORMING DEVICE AND FILM-FORMING METHOD

WIPO Patent Application WO/2018/216226

A1

The film-forming device according to one embodiment of the present invention has: a chamber 21 electrically connected to a grounding potential; a target TG disposed in the chamber; a power supply section 32 that supplies high-frequency power to the target; gas supply sections 23, 24 that supply a gas to the inside of the chamber; a substrate holding insulating section 25b, which is disposed in the chamber, and which holds a substrate SB by having the substrate face the target; a conductive supporting section 42 that supports the substrate holding insulating section; and a first insulating member 53 disposed between the conductive supporting section and the chamber. The conductive supporting section is electrically floating from the chamber due to the first insulating member, the substrate is held by the substrate holding insulating section when an outer peripheral section of the substrate comes into contact with the substrate holding insulating section, the substrate is electrically floating from the conductive supporting section, and the substrate holding insulating section does not overlap a center section of the substrate in plan view.

HONDA YUJI (JP)
KIJIMA TAKESHI (JP)
HAMADA YASUAKI (JP)

PCT/JP2017/020526

November 29, 2018

May 26, 2017

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ADVANCED MATERIAL TECH INC (JP)

H01L21/203; H01L41/187; H01L41/316

WO2007066511A1

2007-06-14

JP2006037172A	2006-02-09
JP2003027229A	2003-01-29
JP2000192223A	2000-07-11
JP2004031493A	2004-01-29
JP2008311552A	2008-12-25
JP2012234924A	2012-11-29
JP2016127057A	2016-07-11

YANASE Mutsuyasu et al. (JP)

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