Title:
FILM FORMING DEVICE AND FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/230526
Kind Code:
A1
Abstract:
This film forming device includes an evacuable process vessel, a lower electrode, an upper electrode, a gas supply unit, and a voltage applying unit. A substrate to be processed is set on the lower electrode. The upper electrode is disposed opposite the lower electrode in the process vessel. The gas supply unit supplies a process space between the upper electrode and the lower electrode with a film forming raw material gas that changes to plasma in the process space. The voltage applying unit applies, to the upper electrode, AC voltage for which the reference potential changes up and down alternatively over time.
Inventors:
MATSUDO TATSUO (JP)
MORITA YASUSHI (JP)
SHINDO TAKAHIRO (JP)
MORITA YASUSHI (JP)
SHINDO TAKAHIRO (JP)
Application Number:
PCT/JP2019/020314
Publication Date:
December 05, 2019
Filing Date:
May 22, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/31; C23C16/503; C23C16/505; C23C16/515; C23C16/517; H05H1/46
Foreign References:
| JP2005026063A | 2005-01-27 | |||
| JPH1131685A | 1999-02-02 | |||
| JP2000313962A | 2000-11-14 | |||
| JP2009071133A | 2009-04-02 | |||
| JP2005340760A | 2005-12-08 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF:
Previous Patent: CONTAINER
Next Patent: MODIFIED HYDROGENATED PRODUCT, METHOD FOR PRODUCING SAME, RESIN COMPOSITION, AND VARIOUS USES THEREO...
Next Patent: MODIFIED HYDROGENATED PRODUCT, METHOD FOR PRODUCING SAME, RESIN COMPOSITION, AND VARIOUS USES THEREO...