Title:
FILM-FORMING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/054464
Kind Code:
A1
Abstract:
This film-forming device used in thermal spraying comprises: a spray gun including a nozzle (2b); a powder supply unit that supplies powder to the spray gun as a film-forming material; and a gas supply unit that supplies an operating gas to the spray gun. The nozzle (2b) includes: a stainless steel pipe (23) serving as a nozzle pipe; a ceramic pipe (22) connected to the stainless steel pipe (23) on the upstream side through which the operating gas flows; and a nozzle holder (21) into which the ceramic pipe (22) is inserted. The nozzle holder (21) includes a first section (21A) extending in a first direction in which the operating gas flows within the nozzle holder (21). The film-forming device further comprises piping (5) connecting the powder supply unit and the first section (21A). Piping (5A), which is a section of the piping (5) connected to the first section (21A), extends in a second direction intersecting the first direction.
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Inventors:
HIRANO MASAKI (JP)
Application Number:
PCT/JP2022/036150
Publication Date:
April 06, 2023
Filing Date:
September 28, 2022
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C23C24/04; B05B7/04; B05B7/16
Domestic Patent References:
| WO2019009206A1 | 2019-01-10 | |||
| WO2008120799A1 | 2008-10-09 | |||
| WO2012086037A1 | 2012-06-28 |
Foreign References:
| JP2006068736A | 2006-03-16 | |||
| EP2014795A1 | 2009-01-14 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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