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Title:
FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FORMING FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/212116
Kind Code:
A1
Abstract:
The present invention provides a film forming material for lithography, which contains a compound having a group of formula (0).

Inventors:
OKADA KANA (JP)
HORIUCHI JUNYA (JP)
MAKINOSHIMA TAKASHI (JP)
ECHIGO MASATOSHI (JP)
Application Number:
PCT/JP2018/018463
Publication Date:
November 22, 2018
Filing Date:
May 14, 2018
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
G03F7/11; C08F22/40; C08L101/02; G03F7/20; G03F7/26
Domestic Patent References:
WO2016129679A12016-08-18
WO2009072465A12009-06-11
WO2011034062A12011-03-24
WO2004066377A12004-08-05
WO2013024779A12013-02-21
WO2011108524A12011-09-09
WO2004009708A12004-01-29
WO2015080240A12015-06-04
Foreign References:
JP2015507212A2015-03-05
JP2010085673A2010-04-15
JP2016086000A2016-05-19
JP2015087613A2015-05-07
JP2004177668A2004-06-24
JP2004271838A2004-09-30
JP2005250434A2005-09-15
JP2002334869A2002-11-22
JP2007226170A2007-09-06
JP2007226204A2007-09-06
JPH1112258A1999-01-19
JP2004352670A2004-12-16
Other References:
See also references of EP 3627224A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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